The Process Capability, Quality and Reliability Program was a unique supply chain management resource provided by Conductor Analysis Technologies and IPC from 2001 to 2023 for designers, manufacturers, and users of printed circuit boards.  The program was based on statistical data collected from industry-developed test patterns which quantified the capability, quality and reliability of printed board manufacturers.

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All test pattern revisions, test methods, test data, analysis techniques, the database, and the web page are the property of Conductor Analysis Technologies, Inc. and may not be used in part or whole without prior written permission.

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