Process capability panels (test patterns) incorporate one or more of the following structures within the same design:

1. Conductor and space
   

2. Via registration
   

3. Via formation and reliability
   

4. Soldermask registration
   

5. Controlled impedance
   

When distributed over the area of the manufacturing panel format and produced in sufficient numbers, they provide the basis for relevant statistics on the capability, quality, and reliability of the process used in their manufacture.

IPC PCQR² Designs

1. Rigid Board
   

2. Via Board
   

3. HDI Designs
   

4. Package Substrate
   

5. Rigid-Flex
   

CAT Designs

1. Innerlayer Conductor and Space
   

2. Plated Layer Conductor and Space
   

3. Dot
   

4. Request a Quotation for a custom design
   

IPC A/B-R Coupon Generator