Technical Papers and Presentations
Via Reliability – A Holistic Process Approach
This paper summarizes the results of two case studies from the IPC PCQR² Database, which document that both process capability and quality must be satisfied before initiating via reliability studies. Relying on reliability studies alone can give a false indication of overall printed circuit board manufacturing capabilities. Published at the IPC/JEDEC Global Conference on Lead Free Reliability and Reliability testing for RoHS Lead Free Electronics in Boston, MA; and at the SMTA Medical Electronics Symposium in Bloomington, MN by David Wolf of Conductor Analysis Technologies, Inc., April/May 2007. Download: Paper or Presentation
Benchmarking Printed Circuit Board Fabrication Suppliers Using IPC's PCQR² Database
This presentation is a practical application of the IPC PCQR² Database where a standardized test vehicle design was utilized to evaluate the materials, equipment and processes used in the manufacture of a high-layer count, sequential lamination design. Published at the 2007 Burn-in and Test Socket (BiTS) Workshop by Bill Mack of Texas Instruments, Inc., March 2007. Download
Via Reliability Test Methods
Comparison data from three reliability test methods 1) dual chamber, 2) Highly Accelerated Thermal Shock (HATS), and 3) current induced (IST) is presented. Published at IPC Works 2005 by Tim Estes of Conductor Analysis Technologies, Inc. and Vicka White of Honeywell, Inc., October 2005. Download
IPC's Process Capability, Quality and Relative Reliability (PCQR²) Database
Standardized PCB Benchmarking Data is Just a Mouse Click Away. Published in IPC Review by David Bergman of IPC and David Wolf of Conductor Analysis Technologies, Inc., October 2005. Download
The Effect of Lead-Free Reflow Profiles on Through Via Reliability
Data from four printed circuit board manufacturers is presented on the effect of lead-free reflow profiles on through via reliability. Published at IPC APEX/EXPO 2005 by Tim Estes of Conductor Analysis Technologies, Inc. and Bob Neves of Microtek Laboratories, February 2005. Download
Optimized System Design Through Industry Benchmarking of Fabrication Tolerances and Material Properties
Benchmarking of industry fabrication capability, feature tolerances and material property variation is essential to aligning product requirements and industry capability. Statistically-based characterization of feature tolerances and material properties are being used to optimize system and silicon designs. Assessment of industry capability is used to validate process improvements and ensure alignment with product. Published at the IPC Annual Meeting by Gary Brist, Gary Long, and Daryl Sato of Intel Corporation, October 2003. Download
A Case Study of an OEM's Program to Assess Supplier Capabilities, Technology Availability, and Reliability for Advanced Printed Circuit Boards
This paper shows a few of the ways that CAT/IPC D-36 testing has been used to determine supplier process capabilities, technology readiness, and design feature parameters. The paper provides an overview of how supplier management utilizes the test results to evaluate existing and potential suppliers, drive for quality improvements, and align parts to suppliers. Also included are the strengths and weaknesses of the current state of the program from Teradyne's perspective. Published at the IPC Annual Meeting by David Evans and Valerie St.Cyr of Teradyne Inc., October 2003. Download
Highly Accelerated Thermal Shock (HATS) Testing for PCB Hole Reliability
This presentation describes a new thermal shock test methodology that builds on the history of the models created for thermal shock testing while removing the disadvantages in cost, time, and sample fixturing that are associated with traditional methods. Published at the IPC/HKPCA International Printed Circuit and Electronics Assembly Fair, December 2003. Download
Highly Accelerated Thermal Shock (HATS) Reliability Testing
This paper introduces a new thermal shock test methodology that builds on the history of the models created for thermal shock testing while removing the disadvantages in cost, time, and sample fixturing that are associated with traditional methods. Published at the IPC Printed Circuits Expo, March 2003. Download
Benchmarking PCB Process Capability, Quality and Reliability Becomes a Reality
Background information is presented on the IPC-PCQR2 program including a summary of the latest industry capability data. Published at the IPC Printed Circuits Expo, March 2003. Download
The Effect of Process Equipment on Fine-Line Uniformity
Information is presented on the sources of process non-uniformities including: laser direct imaging, photo-plotter resolution, and etching. Published at the 2001 IPC Annual Meeting and at the IPC Printed Circuits Expo, March 2003. Download
Printed Board Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard
A review of the IPC D-36 Subcommittee activities. Published at the 2001 IPC Annual Meeting. Download
Printed Circuits Handbook 5th Edition Chapter 36 - Process Capability and Quality
An in-depth discussion of quantitative statistical techniques that distinguish one supplier or process from another. Published in the 5th Edition of the Printed Circuits Handbook by Clyde F. Coombs Jr. Download
Process Capability and Quality
An in-depth discussion of quantitative statistical techniques that distinguish one supplier or process from another. Published in the 2001 Board Authority - Fabrication Basics. Download
2000 HDIS Capability Overview
Several case studies of the HDIS process capability data with emphasis on industry capability trends and proper selection of design rules. Published at the 2000 IPC High Density Interconnect Structures Conference. Download
HDI Performance Validation II
North American, European, and Asian high density interconnect process capabilities. Published in the 2000 Board Authority - HDIS . Download
1999 HDIS Capability Overview
Several case studies of the HDIS process capability data with emphasis on industry capability trends and proper selection of design rules. Published at the 1999 IPC High Density Interconnect Structures Conference. Download
Printed Wiring Board Fabricators - Are They Equally Capable?
Process capability data is used to ensure that OEMs select board suppliers with the capability to manufacture their designs at the required level of quality. Published at the 1999 SMTA International Conference. Download
HDI Performance Validation
Process capability and control are essential for high-quality HDI products. Published in the 1999 Board Authority - HDIS. Download
Understanding and Improving Process Capability
Process capability panels provide a method for measuring and improving printed circuit board manufacturing process capability and quality. Published at the 1998 North East Circuits Association TechCon. Download
